Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 80
Encapsulation parameters/Encapsulation: PQFP
External dimensions/packaging: PQFP
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN74ABT7819-10PN
|
TI | 功能相似 | LQFP |
512 】 18 】 2主频双向先入先出存储器 512 】 18 】 2 CLOCKED BIDIRECTIONAL FIRST-IN, FIRST-OUT MEMORY
|
||
SN74ABT7819A-10PH
|
TI | 功能相似 | BQFP-80 |
512 】 18 】 2主频双向先入先出存储器 512 】 18 】 2 CLOCKED BIDIRECTIONAL FIRST-IN, FIRST-OUT MEMORY
|
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