Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74HC174D
|
NXP | 功能相似 | SOIC |
Flip Flop D-Type Bus Interface Pos-Edge 1Element 16Pin SOIC
|
||
74HC174D
|
Toshiba | 功能相似 | SOIC-16 |
Flip Flop D-Type Bus Interface Pos-Edge 1Element 16Pin SOIC
|
||
74HC174D
|
Rochester | 功能相似 | SSOP |
Flip Flop D-Type Bus Interface Pos-Edge 1Element 16Pin SOIC
|
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