Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HD74HC174P
|
Renesas Electronics | 功能相似 | DIP |
六路D型触发器(带清除) Hex D-type Flip-Flops (with Clear)
|
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