Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
TI | 功能相似 | SOP |
Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1Element 20Pin SOIC W Rail
|
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|
|
National | 功能相似 |
Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1Element 20Pin SOIC W Rail
|
|||
DM74LS374WM
|
Fairchild | 功能相似 | SOP-20 |
Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1Element 20Pin SOIC W Rail
|
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