Technical parameters/RAM size: 192K x 8
Technical parameters/dissipated power: 1500 mW
Technical parameters/dissipated power (Max): 1500 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 324
Encapsulation parameters/Encapsulation: BGA-324
External dimensions/packaging: BGA-324
Physical parameters/operating temperature: -40℃ ~ 125℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SPC5644AF0MVZ2
|
Freescale | 功能相似 | BGA |
NXP SPC5644AF0MVZ2 芯片, 微控制器, 32位, QORIVVA, 4M, 324TEPBGA
|
||
SPC5644AF0MVZ2R
|
NXP | 功能相似 | BBGA-324 |
PowerPC系列 120MHz 4MB 192KB
|
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