Technical parameters/power supply voltage (DC): 2.70V (min)
Technical parameters/working voltage: 2.7V ~ 3.6V
Technical parameters/clock frequency: 80 MHz
Technical parameters/memory capacity: 8000000 B
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 2.7V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/length: 7.34 mm
External dimensions/width: 5.38 mm
External dimensions/height: 1.91 mm
External dimensions/packaging: SOIC-8
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL064P0XMFI001
|
Spansion | 功能相似 | SOIC-16 |
SPANSION S25FL064P0XMFI001 闪存, 或非, 64 Mbit, 104 MHz, SPI, SOIC, 16 引脚
|
||
S25FL164K0XMFI011
|
Spansion | 功能相似 | SOIC-8 |
SPANSION S25FL164K0XMFI011 闪存, 或非, 64 Mbit, 8M x 8位, 108 MHz, SPI, SOIC, 8 引脚
|
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