Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: TSOP
External dimensions/packaging: TSOP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Compliant
Compliant with standards/lead standards: PB free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SST38VF6401-90-5I-EKE
|
Microchip | 功能相似 | TSOP-48 |
SST38VF系列 64Mb4 Mx16 3.3V 高级多功能闪存(MPF+)-TSOP-48
|
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