Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: TFBGA
External dimensions/length: 8 mm
External dimensions/width: 6 mm
External dimensions/packaging: TFBGA
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SST39LF010-45-4C-B3K
|
Silicon Storage Tech | 功能相似 | TFBGA |
512Kbit / 1Mbit / 2Mbit / 4Mbit (x8) Multi-Purpose Flash
|
||
SST39LF010-45-4C-B3KE
|
Microchip | 功能相似 | TFBGA-48 |
Flash Parallel 3.3V 1Mbit 128K x 8Bit 45ns 48Pin TFBGA
|
||
SST39VF010-70-4C-B3KE
|
Silicon Storage Tech | 功能相似 | TFBGA |
Flash Parallel 3.3V 1Mbit 128K x 8Bit 70ns 48Pin TFBGA
|
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