Technical parameters/digits: 28
Technical parameters/power supply voltage: 1.7V ~ 1.9V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TFBGA-160
External dimensions/packaging: TFBGA-160
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SSTU32864EC/G,551
|
NXP | 功能相似 | LFBGA-96 |
寄存器 SSTU32864EC/LFBGA96/TRAYBDP//G
|
||
SSTUH32865ET,557
|
NXP | 完全替代 | TFBGA-160 |
IC BUFFER 1.8V 28Bit SOT802
|
||
SSTUH32865ET/G,557
|
NXP | 完全替代 | TFBGA-160 |
IC BUFFER 1.8V 28Bit SOT802-1
|
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