Technical parameters/RAM size: 2K x 8
Technical parameters/dissipated power: 200 mW
Technical parameters/Analog to Digital Conversion (ADC): 1
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 40 ℃
Technical parameters/dissipated power (Max): 200 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 32
Encapsulation parameters/Encapsulation: VFQFN-32
External dimensions/packaging: VFQFN-32
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
STM8AF6266UCX
|
ST Microelectronics | 类似代替 | VFQFN-32 |
汽车级8位MCU
|
||
STM8AF6266UCY
|
ST Microelectronics | 功能相似 | QFN-32 |
汽车级8位MCU
|
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