Technical parameters/RAM size: 16K x 8
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 144
Encapsulation parameters/Encapsulation: LFBGA-144
External dimensions/packaging: LFBGA-144
Physical parameters/operating temperature: -40℃ ~ 105℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
STR730FZ2T6
|
ST Microelectronics | 完全替代 | LQFP-144 |
ARM7TDMI⑩ 32位MCU与Flash ,3 CAN , 4个UART , 20定时器, ADC ,12个通讯。接口 ARM7TDMI⑩ 32-bit MCU with Flash, 3x CAN, 4 UARTs, 20 timers, ADC, 12 comm. interfaces
|
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STR735FZ1T6
|
ST Microelectronics | 完全替代 | LQFP-144 |
ARM7TDMI⑩ 32位MCU与Flash ,3 CAN , 4个UART , 20定时器, ADC ,12个通讯。接口 ARM7TDMI⑩ 32-bit MCU with Flash, 3x CAN, 4 UARTs, 20 timers, ADC, 12 comm. interfaces
|
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