Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TO-263-3
External dimensions/packaging: TO-263-3
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SUM110P08-11-E3
|
Vishay Siliconix | 类似代替 | TO-263-3 |
MOSFET P-CH 80V 110A D2PAK
|
||
SUM110P08-11-E3
|
Vishay Semiconductor | 类似代替 |
MOSFET P-CH 80V 110A D2PAK
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review