Technical parameters/power supply current: 27.0 mA
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
NXP | 功能相似 | SOIC |
5V ECL ± 4分频器 5V ECL ±4 Divider
|
||
|
|
Freescale | 功能相似 | SOIC |
5V ECL ± 4分频器 5V ECL ±4 Divider
|
||
|
|
Micrel | 完全替代 | SOIC |
5V/3.3V ± 2 DIVIDER
|
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