Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Micrel | 功能相似 | TSSOP |
2.5V/3V, 3GHz CML AnyGate ANY LOGIC WITH 50Ω or 100Ω OUTPUTS
|
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