Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: HTSSOP
External dimensions/packaging: HTSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY88913VKG
|
Microchip | 功能相似 | MSOP-10 |
5V/3.3V 1.25Gbps HIGH-SPEED LIMITING POST AMPLIFIER
|
||
SY88973VEYTR
|
Micrel | 功能相似 | HTSSOP |
3.3V/5V 3.2Gbps CML LOW-POWER LIMITING POST AMPLIFIER W/TTL LOS
|
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