Technical parameters/power supply voltage: 2.7V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-16
External dimensions/packaging: SOIC-16
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MX25L12835FMI-10G
|
MXIC | 功能相似 | SOIC-16 |
MX25L 系列 128 Mb (128 M x 1/64 M x 2/32 M x 4) 104 MHz 串行 闪存 - SOP-16
|
||
S25FL128P0XMFI001
|
Cypress Semiconductor | 功能相似 | SOIC-16 |
SPANSION S25FL128P0XMFI001 芯片, 闪存, 128MB, 104MHZ, SOIC-16
|
||
W25Q128FVFIG
|
Winbond Electronics | 类似代替 | SOIC-16 |
128-Mbit(16M x 8bit),SPI接口,工作电压:2.7V to 3.6V
|
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