Chip AI consultant
Encapsulation parameters/Encapsulation: Die
External dimensions/packaging: Die
Other/Series: FL-P
Other/Packaging: Bulk
Other/Package Case: Die
Other operating temperatures: -40°C ~ 85°C (TA)
Other/Interface: SPI Serial
Other/Voltage Supply: 2.7 V ~ 3.6 V
Other/Supplier Device Packages: Wafer
Other/Memory Size: 32M (4M x 8)
Other/Memory Type: FLASH - NOR
Other/Speed: 104MHz
Other/Format Memory: FLASH
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review