Technical parameters/digits: 8
Technical parameters/access time (Max): 8.5 ns
Technical parameters/operating temperature (Max): 105 ℃
Technical parameters/operating temperature (Min): -40 ℃
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: BGA-24
External dimensions/packaging: BGA-24
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL064P0XMFI001
|
Spansion | 功能相似 | SOIC-16 |
SPANSION S25FL064P0XMFI001 闪存, 或非, 64 Mbit, 104 MHz, SPI, SOIC, 16 引脚
|
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