Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29AS016J70BFI043
|
Cypress Semiconductor | 完全替代 | FBGA |
NOR Flash Parallel 1.8V 16M-bit 2M x 8/1M x 16 70ns 48Pin FBGA T/R
|
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