Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 48
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/length: 18.4 mm
External dimensions/width: 12 mm
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29JL032J60TFI013
|
Cypress Semiconductor | 功能相似 | * |
32 Megabit (4M x 8Bit/2M x 16Bit) CMOS 3V-Only, Simultaneous Read/Write Flash Memory
|
||
S29JL032J60TFI210
|
Spansion | 功能相似 | TSSOP |
32 Megabit (4M x 8Bit/2M x 16Bit) CMOS 3V-Only, Simultaneous Read/Write Flash Memory
|
||
S29JL032J60TFI213
|
Cypress Semiconductor | 功能相似 | * |
32 Megabit (4M x 8Bit/2M x 16Bit) CMOS 3V-Only, Simultaneous Read/Write Flash Memory
|
||
S29JL032J60TFI213
|
Spansion | 功能相似 | TSSOP |
32 Megabit (4M x 8Bit/2M x 16Bit) CMOS 3V-Only, Simultaneous Read/Write Flash Memory
|
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