Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: 3A001
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT71256S70TDB
|
Integrated Device Technology | 功能相似 | DIP |
CMOS静态RAM 256K ( 32K ×8位) CMOS STATIC RAM 256K (32K x 8-BIT)
|
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