Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/packaging: SOIC-8
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SA56004ED,118
|
NXP | 完全替代 | SOIC-8 |
SMBus兼容,远程/本地数字温度传感器
|
||
SA56004EDP,118
|
NXP | 完全替代 | TSSOP-8 |
SMBus兼容,远程/本地数字温度传感器
|
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