Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TC1232CPA
|
Microchip | 完全替代 | DIP-8 |
MICROCHIP TC1232CPA 微处理器监视器, 高电平有效, 低电平有效复位, 4V-5.5V输入, DIP-8
|
||
TC1232EPA
|
Microchip | 类似代替 | DIP-8 |
MICROCHIP TC1232EPA 监视器, 低电平有效, 漏极开路复位, 4V-5.5V输入, DIP-8
|
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