Package parameters/number of pins: 5
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LVC1G32GW
|
Nexperia | 功能相似 | TSSOP |
74LVC1G/74LVC2G 系列,Nexperia 低电压 CMOS 逻辑 单门封装 工作电压:1.65 至 5.5 V 兼容性:输入 LVTTL/TTL,输出 LVCMOS ### 74LVC 系列
|
||
74LVC1G32GW
|
Philips | 功能相似 | TSSOP-5 |
74LVC1G/74LVC2G 系列,Nexperia 低电压 CMOS 逻辑 单门封装 工作电压:1.65 至 5.5 V 兼容性:输入 LVTTL/TTL,输出 LVCMOS ### 74LVC 系列
|
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