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Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SSOP
External dimensions/packaging: SSOP
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Input Signal Types: Single-Ended
Other/Number of Channels per Chip: 2
Other/Number of inputs per chip: 2
Other/Maximum Quiescent Current: 2 uA
Other/Pin Count: 8
Other/Product Dimensions: 2 x 2.3 x 0.7 mm
Other/Operating Temperature: -40 to 85 °C
Other/Lead Finish: Tin/Silver|Tin/Bismuth|Gold
Other/Bus Hold: No
Other/Maximum Low Level Output Current: 8 mA
Other/Typical Operating Supply Voltage: 2.5|3.3|5 V
Other/Maximum Propagation Delay Time @ Maximum CL: 11.5@3.3V|7.5@5V ns
Other/Logic Functions: Buffer/Line Driver
Other/Output Types: 3-State
Other/Number of Elements per Chip: 2
Other/Number of outputs per Chip: 2
Other/Maximum High Level Output Current: -8 mA
Other/Number of Output Enable per Chip: 2 Low
Other/Counting: Surface Mount
Other/Supplier Package: SSOP
Other/Propagation Delay Test Conditions: 50 pF
Other/Polarity: Non-Inverting
Other/Minimum Operating Supply Voltage: 2 V
Other/Maximum Operating Supply Voltage: 5.5 V
Other/Max Processing Temps: 260
Other/ECCN: EAR99
Other/SCHEDULE B: 8542390000
Other/HTSN: 8542390001
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