Technical parameters/thermal resistance: 12.2 ℃/W
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA
External dimensions/width: 27.8 mm
External dimensions/packaging: BGA
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
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