Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: SSOP-24
External dimensions/packaging: SSOP-24
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: Mobile communication reception, professional video
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TDA9884TS/V1,112
|
NXP | 功能相似 | SSOP-24 |
I2C Bus Controlled Multistandard Alignment Free IF PLL 24Pin SSOP Bulk
|
||
TDA9884TS/V1,118
|
NXP | 功能相似 | SSOP-24 |
调节器/解调器 MOBILE VIF AND SIF
|
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