Technical parameters/power supply voltage: 3.3 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: SOIC-28
External dimensions/packaging: SOIC-28
Other/Product Lifecycle: Pre-Release
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: smart card
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TDA8037T/C1Y
|
NXP | 功能相似 | SOIC-28 |
接口 - 专用 Low power 3V smart card interface
|
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