Technical parameters/forward voltage: 1.1 V
Technical parameters/dissipated power: 150 mW
Technical parameters/input current (Min): 50 mA
Technical parameters/forward voltage (Max): 1.5 V
Technical parameters/forward current (Max): 50 mA
Technical parameters/descent time (Max): 5 µs
Technical parameters/rise time (Max): 3.5 µs
Technical parameters/operating temperature (Max): 100 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/dissipated power (Max): 150 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 4
Encapsulation parameters/Encapsulation: PDIP
External dimensions/packaging: PDIP
Physical parameters/operating temperature: -55℃ ~ 100℃
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
FODM2705R2
|
ON Semiconductor | 功能相似 | MFP-4 |
ON Semiconductor 光耦 FODM2705R2, 交流输入, 光电晶体管输出, 4引脚 MFP 封装
|
||
|
|
ISOCOM Components | 功能相似 | DIP |
ON Semiconductor 光耦 双通道 MCT62, 直流输入, 光电晶体管输出, 8引脚 PDIP、PDIP-W 封装
|
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