Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 5
Encapsulation parameters/Encapsulation: TO-66
External dimensions/packaging: TO-66
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Microsemi | 功能相似 | TO-66 |
双高速驱动器 DUAL HIGH SPEED DRIVER
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