Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Bulk
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SG1846J
|
Microchip | 功能相似 |
电流模式PWM控制器 CURRENT MODE PWM CONTROLLER
|
|||
SG1846J/883B
|
SG | 功能相似 |
电流模式PWM控制器 CURRENT MODE PWM CONTROLLER
|
|||
SG1846J/883B
|
Microsemi | 功能相似 | DIP |
电流模式PWM控制器 CURRENT MODE PWM CONTROLLER
|
||
SG2846J
|
Microsemi | 功能相似 | DIP |
电流模式PWM控制器 CURRENT MODE PWM CONTROLLER
|
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