Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 5
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Physical parameters/temperature coefficient: ±30.0 ppm/℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TL4050A41QDCKRG4
|
TI | 类似代替 | TSSOP |
精密微功耗并联型电压基准 PRECISION MICROPOWER SHUNT VOLTAGE REFERENCE
|
||
TL4050B41IDCKR
|
TI | 功能相似 | SC-70-5 |
精密微功耗并联型电压基准 PRECISION MICROPOWER SHUNT VOLTAGE REFERENCE
|
||
TL4050C41QDCKR
|
TI | 功能相似 | SC-70-5 |
精密微功耗并联型电压基准 PRECISION MICROPOWER SHUNT VOLTAGE REFERENCE
|
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