Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLC2552IDG4
|
TI | 功能相似 | SOIC-8 |
12Bit, 400KSPS ADC, Serial Out, TMS320 Compatible (up to 10MHz), Dual Ch. Auto Sweep 8-SOIC -40℃ to 85℃
|
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