Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/packaging: SOIC-8
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLC27M2MD
|
TI | 功能相似 | SOIC-8 |
LinCMOS 运算放大器 ### 运算放大器,Texas Instruments
|
||
TLC27M2MDG4
|
TI | 功能相似 | SOIC-8 |
?????????路LinCMOS精密双运算放大器 LinCMOS PRECISION DUAL OPERATIONAL AMPLIFIERS
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review