Technical parameters/output current: ≤120 mA
Technical parameters/contact type: SPST-NO
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 4
Encapsulation parameters/Encapsulation: DIP
External dimensions/length: 6.40 mm
External dimensions/width: 4.60 mm
External dimensions/height: 3.65 mm
External dimensions/packaging: DIP
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review