Technical parameters/number of circuits: 2
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TPA3000D1PWP
|
TI | 完全替代 | TSSOP |
17 -W单声道无滤波器D类音频功率放大器 17-W MONO FILTER-FREE CLASS-D AUDIO POWER AMPLIFIER
|
||
TPA3008D2PHPR
|
TI | 类似代替 | HTQFP-48 |
10 -W立体声D类音频功率放大器 10-W STEREO CLASS-D AUDIO POWER AMPLIFIER
|
||
TPA3008D2PHPR
|
Rochester | 类似代替 |
10 -W立体声D类音频功率放大器 10-W STEREO CLASS-D AUDIO POWER AMPLIFIER
|
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