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Description The step-down DC/DC converter (integrated switch) has a maximum input of up to 6V, TPS series, Texas Instruments # # DC/DC switching regulator converter (integrated switch). Texas Instruments' highly integrated high-efficiency switching regulators in this series include step-up (boost), step-down (buck), step-up/step-down (boost/buck), and inverting types, providing efficient solutions for every DC regulator application.
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Brand: TI
Packaging XFBGA-6
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
5.17  yuan 5.17yuan
10+:
$ 6.2076
100+:
$ 5.8972
500+:
$ 5.6903
1000+:
$ 5.6800
2000+:
$ 5.6386
5000+:
$ 5.5868
7500+:
$ 5.5455
10000+:
$ 5.5248
Quantity
10+
100+
500+
1000+
2000+
Price
$6.2076
$5.8972
$5.6903
$5.6800
$5.6386
Price $ 6.2076 $ 5.8972 $ 5.6903 $ 5.6800 $ 5.6386
Start batch production 10+ 100+ 500+ 1000+ 2000+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(4306) Minimum order quantity(10)
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Technical parameters/number of output interfaces: 1

Technical parameters/output voltage: 1.8 V

Technical parameters/output current: 500 mA

Technical parameters/Static current: 17.0 µA

Technical parameters/adjusted output number: 1

Technical parameters/switching frequency: 6 MHz

Technical parameters/topology structure: Buck

Technical parameters/input voltage (Max): 4.8 V

Technical parameters/input voltage (Min): 2.3 V

Technical parameters/output voltage (Max): 1.8 V

Technical parameters/output voltage (Min): 1.8 V

Technical parameters/output current (Max): 500 mA

Technical parameters/operating temperature (Max): 85 ℃

Technical parameters/operating temperature (Min): -40 ℃

Technical parameters/input voltage: 2.3V ~ 4.8V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 6

Encapsulation parameters/Encapsulation: XFBGA-6

External dimensions/length: 1.33 mm

External dimensions/width: 0.956 mm

External dimensions/height: 0.225 mm

External dimensions/packaging: XFBGA-6

Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)

Other/Product Lifecycle: Active

Other/Packaging Methods: Tape & Reel (TR)

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
TPS62671YFDR TPS62671YFDR TI 类似代替 XFBGA-6
500mA、6MHz 高效降压转换器,Vout=1.8V 6-DSBGA -40 to 85
TPS62674YFDR TPS62674YFDR TI 功能相似 DSBGA-6
500毫安, 6 MHz的高效率降压转换器低姿态芯片级封装 500-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER IN LOW PROFILE CHIP SCALE PACKAGING
TPS62674YFDT TPS62674YFDT TI 类似代替 XFBGA-6
500毫安, 6 MHz的高效率降压转换器低姿态芯片级封装 500-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER IN LOW PROFILE CHIP SCALE PACKAGING

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