Technical parameters/power supply voltage: 1.8 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 388
Encapsulation parameters/Encapsulation: BGA-388
External dimensions/length: 27.0 mm
External dimensions/width: 27.0 mm
External dimensions/packaging: BGA-388
External dimensions/thickness: 1.17 mm
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Other/Manufacturing Applications: HyperTransport Convert to PCI Bridge
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
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