Technical parameters/power supply voltage: 3.3 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 456
Encapsulation parameters/Encapsulation: PBGA-456
External dimensions/length: 27.0 mm
External dimensions/width: 27.0 mm
External dimensions/packaging: PBGA-456
External dimensions/thickness: 2.65 mm
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: PCI To VME bridge
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review