Technical parameters/Contact electroplating: Gold
Technical parameters/number of rows: 2
Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: -
Packaging parameters/pin spacing: 2.54 mm
External dimensions/packaging: -
External dimensions/pin spacing: 2.54 mm
Physical parameters/shell color: Black
Physical parameters/contact material: Phosphor Bronze
Physical parameters/operating temperature: -55℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Manufacturing Applications: -
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TSW-105-25-S-D-RA
|
Samtec | 完全替代 |
Conn Unshrouded Header HDR 10POS 2.54mm Solder RA Thru-Hole
|
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