Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
UC1825J883B
|
TI | 功能相似 | CDIP |
高速PWM控制器 High Speed PWM Controller
|
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