Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
UC2847DWG4
|
TI | 功能相似 | SOIC-16 |
电流模式PWM控制器 Current Mode PWM Controller
|
||
UC3847DW
|
TI | 功能相似 | SOIC-16 |
电流模式PWM控制器 Current Mode PWM Controller
|
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