Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
UCC2804PW
|
TI | 功能相似 | TSSOP-8 |
低功耗BiCMOS电流模式PWM Low-Power BiCMOS Current-Mode PWM
|
||
UCC3802PW
|
Unitrode | 功能相似 | SOP |
低功耗BiCMOS电流模式PWM Low-Power BiCMOS Current-Mode PWM
|
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