Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOP
External dimensions/width: 3.9 mm
External dimensions/packaging: SOP
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN74LS123D
|
TI | 完全替代 | SOIC-16 |
TEXAS INSTRUMENTS SN74LS123D 芯片, 74LS 逻辑器件
|
||
SN74LS123D
|
ON Semiconductor | 完全替代 | SOP |
TEXAS INSTRUMENTS SN74LS123D 芯片, 74LS 逻辑器件
|
||
SN74LS123D
|
National Semiconductor | 完全替代 | SOP |
TEXAS INSTRUMENTS SN74LS123D 芯片, 74LS 逻辑器件
|
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