Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 4
Other/Product Lifecycle: Not Recommended for New Design
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Microsemi | 功能相似 | MODULE |
Diode Switching 300V 35A 4Pin(3+Tab) MiniMod
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