Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards:
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
8464
|
Heyco | 功能相似 |
IC,LATCH,SINGLE,8-BIT,LS-TTL,DIP,20PIN,PLASTIC
|
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|
|
ON Semiconductor | 功能相似 | DIP |
TEXAS INSTRUMENTS SN74LS373N 逻辑芯片, 透明D型锁存器, 8路, 3态, DIP-20
|
||
SN74LS373N
|
Motorola | 功能相似 | DIP |
TEXAS INSTRUMENTS SN74LS373N 逻辑芯片, 透明D型锁存器, 8路, 3态, DIP-20
|
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