Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN74LS365AD
|
ON Semiconductor | 功能相似 | SOP |
3-STATE HEX BUFFERS LOW POWER SCHOTTKY
|
||
|
|
Motorola | 功能相似 | SOP |
3-STATE HEX BUFFERS LOW POWER SCHOTTKY
|
||
SN74LS365AD
|
TI | 功能相似 | SOIC-16 |
3-STATE HEX BUFFERS LOW POWER SCHOTTKY
|
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