Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube, Rail
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LCX245MTC
|
Fairchild | 功能相似 | TSSOP-20 |
ON Semiconductor 74LCX245MTC 8位 非反相 总线收发器, 20引脚 TSSOP封装
|
||
74LCX245MTC
|
ADI | 功能相似 | TSSOP |
ON Semiconductor 74LCX245MTC 8位 非反相 总线收发器, 20引脚 TSSOP封装
|
||
74LVC245APGG
|
Integrated Device Technology | 功能相似 | TSSOP |
Bus XCVR Single 8CH 3-ST 20Pin TSSOP Tube
|
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