Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN75LP1185DW
|
TI | 功能相似 | SOIC-20 |
低功耗多台RS - 232驱动器和接收 LOW-POWER MULTIPLE RS-232 DRIVERS AND RECEIVERS
|
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