Encapsulation parameters/Encapsulation: -
External dimensions/packaging: -
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: Communication and Networking, Embedded Design and Development
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
Customs information/ECCN code: 3A991.a.2
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